Products catalog

Apart from a variety of carrier and dicing frame products, GMTC also manufactures sheet metal products and precision metal parts for ATM, automobile and machinery. The following samples are our custom laser-cut parts/products, which include not only laser-cut process but also bending, drilling and...

For the purpose of manufacturing high quality semiconductor wafer, the sliced wafer from a silicon ingot requires surface flatness by specular finish and highly uniform thickness. The wafer production processes of ensuring such precision surface flatness and planarization are called lapping and...

The carrier with a plastic insert which is firmly bonded at the circumference of an inner hole is called the insert lapping/polishing carrier.

The plastic insert and steel carrier work monolithically to protect the edge profile of a silicon wafer. As a result,the insert carrier can increase the production yield of silicon wafers, preventing chips, cracks and scratches on a silicon wafer in lapping and polishing processes. Based on the...

In wafer production processes, there is a process called "dicing process", which is to dice a silicon wafer, more specifically, cut out a silicon wafer into hundreds of chips. A special jig, "Dicing Frame", otherwise known as "Wafer Ring" is used to hold a silicon wafer in the process. We can...

With the splendid features of advanced CNC laser machines, ultra high-speed and high accuracy processing, the lead time can be shorten to meet the customers' demand. The optional cutting methods such as Easy cut, Clean cut and Oxygen cut are available according to the type and thickness of...